產品介紹
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產品介紹

Product Description

首頁 > 產業專用檢測機 > 半導體產業 >

Wire Bonding 銲點檢測系統

產品名稱

Wire Bonding 銲點檢測系統

產品型號

1

產品介紹

Wire Ball Inspecting Items

- Ball missing

- Ball placement

- Ball size

- Ball broken

- Ball defect

Wire Bonding Inspecting items

- Wire broken

- Wire missing

- Wire unbonded

- Wire short

- Wire height

- Wire close gap

- Wire height

- Wire sway

Bumping Inspecting Items

- Bump ball missing

- Bump ball placement

- Bump ball size

- Bump ball broken